Thesis, internship, and post-doc opportunities
[Thèse]
Quality of service on multicore Network-on-Chip through bandwidth sharing by quotas method and dynamic reconfiguration
Offer N°: 5679
Start date: 1 Oct 2010
For the communication inside embedded systems, Network-on-Chip have replaced busses for few years. NoCs infrastructure allow more badwidth and smaller latency. Anyway, even with such powerful communication medium, hardware resources are still limited and must be used as well as possible. Adding quality-of-service is then a plus to these architectures.
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Multifunctional polymer particles for biological samples preparation
Offer N°: 5676
Start date: 1 Oct 2010
In the frame of water monitoring, micro organisms detection in a sample involves complex manual steps which implies notably delay between sampling and result. An evolution of the tests towards automated and miniaturised systems coupled with a direct method of analysis may be a very good way to access much more quickly to information and thus to react more rapidly in the case of alert.
[Thèse]
Study of physico-chemical & electrical properties for polymer material in case of 3D intergation
Offer N°: 5665
Start date: 1 Oct 2010
3D integration consists of several chips stacked vertically, thus allowing the manufacturing of electronics components lower size, more rapid and cheaper. One of this technology developped at Leti, uses some TSV (Through Silicon Vias), as well as chips stacking flip-chip type. When stacked, we need to fill inter-die (within 2 levels of vertical assemble, and between 2 chips stacked horizontally on the same base wafer), in order to ensure mechanical stability and global reliability.
[Thèse]
Self assembly assited by capillary effect and direct bonding
Offer N°: 5636
Start date: 1 Oct 2010
To manufacture innovative micro systems thanks to 3D integration, dice to wafer assembly is required. Currently assembly is realized by robotic approaches. However they are based on a serial approach where speed or aligment accuracy is limited. Nowadays peak and place equipments enable a throughput of 100 dices per hour with a 1 µm alignment. This speed limitation explains the emergence of self assembly techniques.
